Electrochemical effect of Copper Gleam additives during copper electrodeposition
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چکیده
منابع مشابه
Analysis of Current-Potential Hysteresis during Electrodeposition of Copper with Additives
Two models are described for cyclic voltammetry during electrodeposition of copper from an acid sulfate bath containing the additives polyethylene glycol (PEG), chloride ions, and mercapto-1-propanesulfonate (MPSA). The same bath may be used for superfilling of cavities during fabrication of copper on-chip metallization. Experimental current-potential scans show a characteristic hysteresis in s...
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Surface-enhanced Raman scattering ~SERS! spectroelectrochemical investigations have been carried out in real time on the electrodeposition of copper from sulfuric acid solutions. Sulfate spectra were observed during copper deposition, but not on a copper surface at the same potential in the absence of copper ions in solution. This indicated that sulfate adsorption is a transient process associa...
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ژورنال
عنوان ژورنال: Transactions of the IMF
سال: 2017
ISSN: 0020-2967,1745-9192
DOI: 10.1080/00202967.2017.1256103